
( Brand: Hp ), ( Manufacturer Part Number: 840401-002 ), ( Model: DL560-GEN10 ), ( Part Type: Heatsink ), ( Compatible Cpu Brand: Intel ), ( Form Factor: Proprietary ), ( Input/output Ports: Vga, Usb, Rj-45, Seraial ), ( Memory Type: Ddr4 Sdram ), ( Number Of Memory Slots: 24 ), ( Socket Type: Lga3647 )
The HP DL560 Gen10 Motherboard (model number 840401-002) is a high-performance computing solution designed for data center environments. This motherboard is part of HP's DL500 Series Gen10 servers, which are known for their reliability, scalability, and energy efficiency.
One of the standout features of this motherboard is its integrated high-performance heatsinks. These heatsinks are designed to effectively dissipate heat generated by the processor and other components, ensuring optimal operating temperatures and improving overall system performance. The heatsinks are strategically placed to cover critical areas of the motherboard, providing comprehensive cooling for the server.
Another significant feature is the integrated Power Supply Unit (PSU) riser. This riser allows for the installation of an optional hot-plug external PSU, providing redundant power sources for the server. This feature enhances system availability by minimizing downtime during power supply maintenance or replacement. The PSU riser also supports HP's hot-plug PSUs, which can be swapped out without powering down the server, ensuring minimal disruption to operations.
The HP DL560 Gen10 Motherboard (840401-002) is built on the Intel Xeon Scalable processor platform, supporting up to 2 processor sockets with Intel Xeon Gold and Platinum processors. It offers 8 DDR4 DIMM slots, allowing for a maximum memory capacity of 3TB. The motherboard also supports Intel Optane DC persistent memory, enabling faster access to data and reducing the need for frequent disk I/O.
In terms of connectivity, the motherboard offers a range of expansion options, including 2 PCIe Gen3 x16 slots, 4 PCIe Gen3 x8 slots, and 2 PCIe Gen3 x4 slots. It also supports 2 SFP and 2 SAS expansion slots, providing flexibility for various data transfer and storage needs.
The motherboard's I/O panel offers a comprehensive set of ports, including 2 USB 3.0 ports, 2 USB 2.0/1.1 ports, 2 RJ-45 Gigabit Ethernet ports, and a console port. It also supports HP iLO 5, providing remote management capabilities for the server.
The HP DL560 Gen10 Motherboard (840401-002) is designed for high-density, high-availability environments. It offers robust features, such as built-in redundant power supplies, hot-plug HPE FlexibleLOM 10 Gb Ethernet adapters, and support for HP Smart Array controllers. These features contribute to the server's reliability, ensuring minimal downtime and maximum uptime for critical workloads.
The HP DL560 Gen10 motherboard, when paired with high performance heatsinks and a PSU riser, can offer several advantages for data center and enterprise environments. This upgrade can help improve thermal management, power delivery, and expandability. Let's discuss the potential pros and cons:
Pros:1. Enhanced Thermal Management: High performance heatsinks help dissipate heat more effectively, reducing the risk of overheating and maintaining optimal operating temperatures. This can lead to increased reliability and longer component lifespan.
2. Improved Power Delivery: A PSU riser allows for more efficient power distribution, reducing power loss and increasing overall system efficiency. This can lead to energy savings and lower operational costs.
3. Expandability: The HP DL560 Gen10 server supports up to 4 GPUs or FPGAs, and the use of high performance heatsinks and a PSU riser can accommodate these high-power components. This can be beneficial for applications that require significant computational power, such as AI, machine learning, or HPC workloads.
4. Reduced Noise: High performance heatsinks can help reduce fan noise by allowing for lower fan speeds when operating at optimal temperatures. This can lead to a quieter data center environment.
5. Compatibility and Integration: HP's high performance heatsinks and PSU riser are specifically designed for the DL560 Gen10 motherboard, ensuring a seamless integration and compatibility.
Cons:1. Cost: The use of high performance heatsinks and a PSU riser can add to the overall cost of the server. This may not be a feasible option for budget-conscious organizations or small businesses.
2. Complexity: Installing high performance heatsinks and a PSU riser can add complexity to the server build process. This may require additional time and expertise, potentially increasing the total cost of ownership.
3. Maintenance: High performance heatsinks and a PSU riser may require more frequent maintenance due to the increased heat output and power draw. This could lead to additional labor costs and downtime.
Conclusion:The HP DL560 Gen10 motherboard, when equipped with high performance heatsinks and a PSU riser, offers several advantages for data center and enterprise environments. These advantages include enhanced thermal management, improved power delivery, increased expandability, reduced noise, and seamless integration. However, the upgrade comes with a higher cost, additional complexity, and increased maintenance requirements. Ultimately, the decision to invest in these upgrades depends on the specific needs and resources of the organization. For applications that require significant computational power and high-density deployment, the benefits may outweigh the costs. For smaller deployments or budget-conscious organizations, the added complexity and cost may not be justifiable. It's essential to carefully evaluate the specific use case and consider the total cost of ownership before making a decision. If the benefits align with the organization's needs, the HP DL560 Gen10 motherboard with high performance heatsinks and a PSU riser can be a valuable investment.
Orders must be prepaid before or at time of pickup. HP 840401-002 DL560 Gen10 Motherboard w/ High Performance Heatsinks PSU Riser.